Thin wafer handling - Study of temporary wafer bonding materials and processes
نویسنده
چکیده
This paper reviews the major adhesives and processes used for 3D TSV thin wafer handling, provides thermal and other performance data on the materials and processes and attempts to establish a first order estimate of process related thermal performance using a common analytical method.
منابع مشابه
High-Performance Temporary Adhesives for Wafer Bonding Applications
Myriad structures for stacking chips, power devices, smart cards, and thin substrates for processors have one thing in common: thin silicon. Wafer thinning will soon be an essential process step for most of the devices fabricated and packaged henceforth. The key driving forces for thinned wafers are improved heat dissipation, three-dimensional stacking, reduced electrical resistance, and substr...
متن کاملCarrier techniques for thin wafer processing
Three different types of carrier techniques have been investigated and developed: thermal release tapes, solvable thermoplastic glue layer and mobile electrostatic carrier. These carriers were applied for manufacture of ultra-thin RFID chips, 12 μm thin CMOS image sensors and to a new process sequence that enables the formation of solder balls at the front side of an already thinned device wafe...
متن کاملPossible Methods for Measuring the Impact of Bubbles in Temporary Bonding Materials for 3D Integration
The progresses observed in the microelectronic industry with an increase in applications based on thin wafers and thin microelectronic substrates have made the use of glues for permanent and temporary bonding an essential part in the processing and handling of thin substrates during manufacturing. The evolution of MEMS device technology into high volume production sees the need for materials wh...
متن کاملImpact of Silicon Wafer Orientation on the Performance of Metal Source/Drain MOSFET in Nanoscale Regime: a Numerical Study
A comprehensive study of Schottky barrier MOSFET (SBMOSFET) scaling issue is performed to determine the role of wafer orientation and structural parameters on the performance of this device within Non-equilibrium Green's Function formalism. Quantum confinement increases the effective Schottky barrier height (SBH). (100) orientation provides lower effective Schottky barrier height in compa...
متن کاملThe Role of Wafer Bonding in 3D Integration and Packaging
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bonding, both permanent and temporary, in the fabrication of 3D-IC. Additionally, the materials and process flows used for...
متن کامل